CCL(XPC Covered copper plate)

can be applied to complex circuits,good toughness competitice price!!!!!

This product is a kind of laminated board formed through heat processing by bleaching wood pulp dips into PF resins, used for all kinds of potential device and as printed wiring board pad.

The surface should be flat and smooth, color is in uniformity, does not allow any impurity, bubble, pitting & knob spot on it. There is no black spot at basic material. The heavy scrape and nick is not allowed. The edge is cut tidy and the end surface has no crackle, delamination or slag dropping.

Table 1 Performance index

Sr. Index name Unit Index 1 Warp or distort Mm ≤10 2 Water absorption rate % ≤4.8 3 Insulation resistance Normal status Ω ≥1.0×109 After boiling ≥1.0×107 4 Water absorbing expansion rate Portrait % ≤0.3 Cross direction ≤0.5 5 Heat resistant performance A21015Min % No delamination or bubble. B portrait size changes after damped. ≤0.35

Note: For additional technical requirement,the color can be negotiated by supplier and purchaser.

CCL(XPC Covered copper plate)